Warqad iyo Kartoon
Daaweynta Dusha Plasma ee Multi-Waraaqo Lakab ah & Lamination Cardboard
Daawaynta balaasmaha heerkulka hooseeya waa Hannaan qalalan oo wax-ku-ool ah oo aad u hufan kaas oo wanaajiya ku-xidhka interlayerka ee alaabooyinka badan ee dahaaran (tusaale, warqad{4}}kartoon- isku dhafan caag ah). Iyada oo wax ka beddeleysa tamarta dusha sare iyo abuurista qallafsanaanta nanoscale, balasma waxa ay hawlgelisaa sagxadaha substrate iyada oo aan wax laga beddelin sifooyinka badan. Tani waxay awood u siinaysaa isku xidhka adag ee ka dhexeeya lakabyo aan la mid ahayn (tusaale, dahaarka, filimada, ama bio{10}caqabadaha ku salaysan) iyadoo la dhimayo xabagta, alwaaxyada, iyo dareerayaasha deegaanka waxyeelada leh ilaa 100% habka wax soo saarka.
Muhiimad ahaan, tignoolajiyada balasmaha ayaa ka baxsan khadadka wax soo saarka. Marxaladda ka danbeysa -marxaladaha habaynta, waxa ay si weyn u wanaajisaa adhesion:
- Daabacaada khadadka iyo ka-hortagga dahaarka been abuurka ah{{0}
- Biyaha - caqabadaha u adkaysta (tusaale, SF₆ balasmaha ee fluorination)
- Eco - dahaarka saaxiibtinimo (tusaale, warshad{3}}saliid{4}} lakabyada hydrophobic ku salaysan)
- UV-Xabagta la daweyn karo iyo shaabadeynta dib loo warshadeyn karo
